Texas Instruments TMS570LS0714

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TMS570LS0714
SPNS226E –JUNE 2013–REVISED NOVEMBER 2016 www.ti.com
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5.7 Thermal Resistance Characteristics
Table 5-1 shows the thermal resistance characteristics for the QFP - PGE mechanical package.
Table 5-2 shows the thermal resistance characteristics for the QFP - PZ mechanical package.
Table 5-1. Thermal Resistance Characteristics (PGE Package)
°C/W
RΘ
JA
Junction-to-free air thermal resistance, still
air using JEDEC 2S2P test board
37.5
RΘ
JB
Junction-to-board thermal resistance 19.7
RΘ
JC
Junction-to-case thermal resistance 9.4
Ψ
JT
Junction-to-package top, Still air 0.40
Table 5-2. Thermal Resistance Characteristics (PZ Package)
°C/W
RΘ
JA
Junction-to-free air thermal resistance, still
air using JEDEC 2S2P test board
43.5
RΘ
JB
Junction-to-board thermal resistance 21.6
RΘ
JC
Junction-to-case thermal resistance 11.2
Ψ
JT
Junction-to-package top, Still air 0.50