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Toradex Verdin - Page 5

Toradex Verdin
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Verdin Carrier Board Design Guide
Preliminary Subject to Change
Toradex AG l Ebenaustrasse 10 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l info@toradex.com
Page | 5
3.5.3 Potential Issues Caused by Backfeeding ................................................................ 82
3.5.4 Identify Backfeeding Issues .................................................................................. 83
3.5.5 Backfeeding Prevention ....................................................................................... 86
4 Mechanical and Thermal Consideration........................................................................ 95
4.1 Module Connector and Stacking Height ........................................................................... 95
4.2 Fixation of the Module .................................................................................................... 96
4.3 Thermal Solution ........................................................................................................... 96
4.4 Module Dimensions ....................................................................................................... 97
4.5 Connector and Standoff Land Pattern Requirements ......................................................... 97
4.6 Carrier Board Space Requirements ................................................................................. 98
5 Appendix A Module Top Side Signal Definition .......................................................... 99
6 Appendix B Module Bottom Side Signal Definition ................................................... 103
7 Appendix C - Physical Pin Definition and Location ..................................................... 107

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