ZED-F9P-Integration Manual
UBX-18010802 - R02
8 Design Page 94 of 114
Advance Information
Care must also be exercised with placing the receiver in proximity to circuitry that can emit heat. The
RF part of the receiver is very sensitive to temperature and sudden changes can have an adverse
impact on performance.
Attention :The TCXO of a GNSS receiver is a temperature sensitive device. Avoid high
temperature drift and air convection.
8.7.2 Package footprint, copper and solder mask
Copper and solder mask dimensioning recommendations for the ZED-F9P high precision receiver
packages are provided in this section. For all packages, the yellow color shows the copper (etch)
dimensions, the green color shows the solder mask opening dimensions and the red circles indicate
vias. Some PCB manufacturers prefer to adapt solder mask openings to their process tolerances.
The recommendations given in this section provide the nominal openings not including such
additional tolerances.
Paste mask recommendations are not provided as these are usually specifically related to the solder
paste in use as well as the particular re-flow process.
The module edge pads are 0.8 mm x 1.5 mm. Solder mask for the same pad is 0.9 mm x 1.6
mm. Paste mask for the same pad is 0.75 mm x 1.55 mm. Implement a pad size on your PCB
as a copper pad size of 0.8 mm x 1.5 mm. The same dimensions as the pads on the module.
Units below are in mm.
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