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u-blox ZED-F9P Integration Manual

u-blox ZED-F9P
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ZED-F9P-Integration Manual
UBX-18010802 - R02
8 Design Page 99 of 114
Advance Information
Figure 74: RF input trace
The RF in trace on the Top layer should be referenced to a suitable ground layer.
8.8.2 Vias for the ground pads
The ground pads under the ZED-F9P high precision receiver need to be grounded with vias to the
lower ground layer of the PCB. A solid ground layer fill on the Top layer of the PCB is recommended.
This is shown in the figure below.
Figure 75: Top layer fill and vias
8.8.3 VCC pads
The VCC pads for the ZED-F9P high precision receiver need to be as low an impedance as possible
with large vias to the lower Power layer of the PCB. The VCC pads need a large combined pad and
the de-coupling capacitors must be placed as close as possible. This is shown in the figure below.

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u-blox ZED-F9P Specifications

General IconGeneral
GNSSGPS, GLONASS, Galileo, BeiDou, QZSS, SBAS
Concurrent GNSS4
RTKYes
Velocity Accuracy0.05 m/s
Time Pulse Accuracy30 ns
Operating Temperature-40°C to +85°C
Supply Voltage2.7 V to 3.6 V
Channels184
Frequency BandsL1, L2
Dimensions22 mm x 17 mm x 2.4 mm
InterfacesUART, SPI, I2C

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