ZED-F9P-Integration Manual
UBX-18010802 - R02

8 Design Page 99 of 114
Advance Information
Figure 74: RF input trace
The RF in trace on the Top layer should be referenced to a suitable ground layer.
8.8.2 Vias for the ground pads
The ground pads under the ZED-F9P high precision receiver need to be grounded with vias to the
lower ground layer of the PCB. A solid ground layer fill on the Top layer of the PCB is recommended.
This is shown in the figure below.
Figure 75: Top layer fill and vias
8.8.3 VCC pads
The VCC pads for the ZED-F9P high precision receiver need to be as low an impedance as possible
with large vias to the lower Power layer of the PCB. The VCC pads need a large combined pad and
the de-coupling capacitors must be placed as close as possible. This is shown in the figure below.
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