General Procedures and Information
6-54 11/05 Workcentre PE 220
GP 11 Acronyms and Abbreviations
The table below explains the abbreviations and acronyms used in this service manual. Where ab-
breviations or acronyms are used in the text please refer to this table.
Table 1: Acronyms and Abbreviations
Abbreviations  Explanation 
AP Access Point
AC Alternating Current 
APC  Auto Power Control 
ASIC  Application Specific Integrated Circuit 
BIOS  Basic Input Output System 
BLDC  Brush-less Direct Current 
CN connector 
CON connector 
CPU  Central Processing Unit 
dB decibel 
dbA decibel A 
dBM decibel milliwatt 
DC direct current 
DCU  Diagnostic Control Unit 
DPI  Dot Per Inch 
DRAM  Dynamic Random Access Memory 
DVM Digital Voltmeter 
ECP  Enhanced Capability Port 
EDC  Embedded Diagnostic control 
EEPROM  Electronically Erasable Programmable Read Only Memory 
EMI Electro Magnetic Interference 
EP electrophotographic 
EPP  Enhanced Parallel Port 
FPOT  First Printout Time 
F/W firmware 
GDI  graphics device interface 
GND ground 
HBP Host Based Printing 
HDD  Hard Disk Drive 
H/H  High temperature and high humidity 
HV high voltage 
HVPS  High Voltage Power Supply 
I/F interface 
I/O Input and Output 
IC integrated circuit 
IDE Intelligent Drive electronics or Embedded Drive Electronics 
IEEE  Institute of Electrical and Electronics Engineers. Inc. 
IPA Isopropy Alcohol 
IPM Images Per Minute