1 Publication 1756-UM514B-EN-P - February 2003
Appendix
A
Specifications
Module Location ControlLogix chassis
Maximum Backplane
Current Load
850mA @ +5.1V dc and 1.7mA @ 24 V dc
from I/O chassis backplane
Power Dissipation 4.5W maximum
Thermal Dissipation 15.4 BTU/hr maximum
Available Baud Rates 57.6Kbaud
115.2Kbaud
230.4Kbaud
Environmental Conditions:
Operating Temperature IEC 60068-2-1 (Test Ad, Operating Cold),
IEC 60068-2-2 (Test Bd, Operating Dry Heat),
IEC 60068-2-14 (Test Nb, Operating Thermal Shock):
0 to 60°C (32 to 140°F)
Storage Temperature IEC 60068-2-1 (Test Ab, Un-packaged Non-operating Cold),
IEC 60068-2-2 (Test Bb, Un-packaged Non-operating Dry
Heat),
IEC 60068-2-14 (Test Na, Un-packaged Non-operating
Thermal Shock):
–40 to 85°C (–40 to 185°F)
Relative Humidity IEC 60068-2-30 (Test Db, Un-packaged Non-operating Damp
Heat):
5 to 95% non-condensing
Vibration IEC60068-2-6 (Test Fc, Operating):
2g @ 10-500Hz
Shock IEC60068-2-27: Test Ea (Unpackaged shock, ES#002)
Operating 30g
Non-operating 50g
Emissions CISPR 11:
Group 1, Class A
ESD Immunity IEC 61000-4-2:
6kV contact discharges
8kV air discharges
Radiated RF Immunity IEC 61000-4-3:
10V/m with 1kHz sine-wave 80%AM from 80MHz to
2000MHz
10V/m with 200Hz 50% Pulse 100%AM at 900Mhz
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