FRAMOS D455e - Thermal Design Consideration; Mechanical Drawings; FRAMOS D4 Visual Processing Board; Depth Module Interposer

FRAMOS Industrial Depth Camera D400e Series - User Manual
Version 1.6.0
from 2021-10-15 29 of 64
5.3 Thermal Design Consideration
When integrating D400e Module variant in a custom design, thermal mechanical design must be
considered.
Recommendation:
A heat sink should be designed to have optimal contact with
all elements of the PCBs backside. The back cover of the housed version can
be used as reference design. When designed
according to the
recommendation, the D400e Module Variant can achieve the thermal conditions
described in the "Optimum Thermal Conditions" chapter.
5.4 Mechanical Drawings
5.4.1 FRAMOS D4 Visual Processing Board
Top and side views and dimensions [mm] for the FRAMOS D4 Visual Processing Board are shown
in the image below.
Figure 11 – FRAMOS D4 Visual Processing Board Dimensions
5.4.2 Depth Module Interposer
Figure 12 – Depth Module Interposer Dimensions