Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

LGA775 Socket Heatsink Loading
10 Thermal and Mechanical Design Guidelines
1.1.3 Document Scope
This design guide supports the following processor:
• Intel
®
Core™2 Extreme processor QX6800 B3 Stepping
• Intel
®
Core™2 Extreme processor QX9770 C0 Stepping
In this document when a reference is made to “the processor” it is intended that this
includes all the processors supported by this document. If needed for clarity, the
specific processor will be listed.
In this document, when a reference is made to “the datasheet”, the reader should
refer to the Intel
®
Core™2 Extreme Processor QX9000 Series and Intel
®
Core™2 Quad
Processor Q9000 Series Datasheet and Intel
®
Core™2 Extreme Quad-Core Processor
QX6000
Δ
Sequence and Intel
®
Core™2 Quad Processor Q6000
Δ
Sequence Datasheet,
as appropriate. If needed for clarity the specific processor datasheet will be
referenced.
Chapter
2 of this document discusses package thermal mechanical requirements to
design a thermal solution for the processor in the context of personal computer
applications. Chapter
3 discusses the thermal solution considerations and metrology
recommendations to validate a processor thermal solution.
Chapter
4 addresses the benefits of the processor’s integrated thermal management
logic for thermal design.
Chapter
5 gives information on the Intel reference thermal solution called ALCT (Intel
Advanced Liquid Cooling Technology) for the processor. Chapter 6 discusses the
implementation of Intel
®
Quiet System Technology.
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3