Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Intel Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines 45
5.2.1.2 Shock Test Procedure
Recommended performance requirement for a motherboard:
•
Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e.,
total 18 drops).
•
Profile: 50 G trapezoidal waveform, 11 ms duration, 170 in/sec minimum
velocity change.
•
Setup: Mount sample board on test fixture.
Figure 12. Shock Acceleration Curve
0
10
20
30
40
50
60
0
2
4 6
8
10 12
Time
(
milliseconds
)
A
c
c
e
l
e
r
a
t
i
o
n
(g)
5.2.1.2.1 Recommended Test Sequence
Each test sequence should start with components (i.e., motherboard, heatsink
assembly, etc.) that have never been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and
BIOS/CPU/Memory test (refer to Section 5.2.3).
Prior to the mechanical shock & vibration test, the units under test should be
preconditioned for 72 hours at 45 ºC. The pre-conditioning is intended to present the
system burn-in and shipping/storage environment stress.
The stress test should be followed by a visual inspection and then BIOS/CPU/Memory
test.

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3