Intel QX9770 - Core 2 Extreme Quad-Core Processor

Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction.....................................................................................................9
1.1 Document Goals and Scope .....................................................................9
1.1.1 Importance of Thermal Management............................................9
1.1.2 Document Goals........................................................................9
1.1.3 Document Scope.....................................................................10
1.2 References..........................................................................................11
1.3 Definition of Terms...............................................................................11
2 Processor Thermal/Mechanical Information.........................................................13
2.1 Mechanical Requirements ......................................................................13
2.1.1 Processor Package...................................................................13
2.1.2 Heatsink Attach ......................................................................15
2.1.2.1 General Guidelines....................................................15
2.1.2.2 The Pump Assembly Clip Load Requirement..................15
2.1.2.3 Additional Guidelines.................................................16
2.2 Thermal Requirements..........................................................................16
2.2.1 Processor Case Temperature.....................................................16
2.2.2 Thermal Profile .......................................................................17
2.2.3 T
CONTROL
..................................................................................18
2.3 Heatsink Design Considerations..............................................................19
2.3.1 Heatsink Size..........................................................................20
2.3.2 Package IHS Flatness...............................................................20
2.3.3 Thermal Interface Material........................................................21
2.4 System Thermal Solution Considerations .................................................21
2.4.1 Chassis Thermal Design Capabilities...........................................21
2.4.2 Improving Chassis Thermal Performance ....................................21
2.4.3 Summary...............................................................................22
2.5 System Integration Considerations..........................................................22
3 Thermal Metrology..........................................................................................23
3.1 Characterizing Cooling Performance Requirements ....................................23
3.1.1 Example ................................................................................25
3.2 Processor Thermal Solution Performance Assessment ................................26
3.3 Local Ambient Temperature Measurement Guidelines.................................26
3.4 Processor Case Temperature Measurement Guidelines ...............................29
4 Thermal Management Logic and Thermal Monitor Feature.....................................31
4.1 Processor Power Dissipation...................................................................31
4.2 Thermal Monitor Implementation............................................................31
4.2.1 PROCHOT# Signal...................................................................32
4.2.2 Thermal Control Circuit ............................................................32
4.2.3 Thermal Monitor 2...................................................................33
4.2.4 Operation and Configuration .....................................................34
4.2.5 On-Demand Mode ...................................................................35
4.2.6 System Considerations.............................................................35
4.2.7 Operating System and Application Software Considerations...........36