Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 89
Figure 46. Solder Station Setup
21. Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note: Do not touch the copper heater block at any time as this is very hot.
22. Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
23.
Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded
Note: The target IHS temperature during reflow is 150°C ±3°C. At no time should the IHS
temperature exceed 155 °C during the solder process as damage to the device may
occur.

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3