Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Case Temperature Reference Metrology
88 Thermal and Mechanical Design Guidelines
16. Place the two pieces of solder in parallel, directly over the thermocouple bead
(
Figure 45)
Figure 45. Positioning Solder on IHS
17. Measure the resistance from the thermocouple end wires again using the DMM
(refer to Section
D.5.1, step 2) to ensure the bead is still properly contacting the
IHS.
D.5.3 Solder Process
18. Make sure the thermocouple that monitors the Solder Block temperature is
positioned on the Heater block. Connect the thermocouple to a handheld meter to
monitor the heater block temperature
19.
Verify the temperature of the Heater block station has reached 155°C ±5°C before
you proceed.
20.
Connect the thermocouple for the device being soldered to a second hand held
meter to monitor IHS temperature during the solder process.

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3