LGA775 Socket Heatsink Loading
56 Thermal and Mechanical Design Guidelines
Using the cooling approach on the Intel D975XBX2 Desktop Board the CPU current
draw vs. heat exchanger fan speed is shown in
Figure 20 and Table 9 as well as the
performance of not having this cooling feature. This was measured as the maximum
current draw before the VR circuitry reaches its maximum temperature and asserts
the PROCHOT# signal.
The socket has a maximum temperature specification to maintain proper electrical
performance at the contacts. Based on this temperature the current capability is
slightly reduced but still shows improved capability of over 20 A at 100% speed over
not having this feature.
Figure 20. CPU Maximum Current Draw for Heat Exchanger Fan Speed
CPU maximum current draw capability
at 35C external ambient
100
110
120
130
140
150
160
170
180
190
0% 20% 40% 60% 80% 100% 120%
Heat Exchanger Fan Speed (PWM)
CPU Current (A)
VR/Socket Cooling Feature No Cooling Feature
Table 9. Maximum Estimated Processor Current Capability at 35 ºC External Ambient
Fan Speed (PWM) Max. Current Draw for
Heat Exchanger with VR
and Socket Airflow
Cooling Feature (A)
Max. Current Draw
for Heat Exchanger
and fan with no
Cooling Feature (A)
25% – VR Requirements 115 105
60% – VR Requirements 150 120
100% – VR Requirements 180 150
100% – Socket Requirements
(1)
165 140
NOTES:
1. Socket temperature requirement is based on the maximum temperature necessary for
end of life socket electrical performance
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