Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Thermal Metrology
Thermal and Mechanical Design Guidelines 29
3.4 Processor Case Temperature Measurement
Guidelines
To ensure functionality and reliability, the processor is specified for proper operation
when T
C
is maintained at or below the thermal profile as listed in the datasheet. The
measurement location for T
C
is the geometric center of the IHS. Figure 2 shows the
location for T
C
measurement.
Special care is required when measuring T
C
to ensure an accurate temperature
measurement. Thermocouples are often used to measure T
C
. Before any temperature
measurements are made, the thermocouples must be calibrated, and the complete
measurement system must be routinely checked against known standards. When
measuring the temperature of a surface that is at a different temperature from the
surrounding local ambient air, errors could be introduced in the measurements. The
measurement errors could be caused by poor thermal contact between the junction of
the thermocouple and the surface of the integrated heat spreader, heat loss by
radiation, convection, by conduction through thermocouple leads, or by contact
between the thermocouple cement and the heatsink base.
Appendix D defines a reference procedure for attaching a thermocouple to the IHS of
a 775-Land LGA processor package for T
C
measurement. This procedure takes into
account the specific features of the 775-Land LGA package and of the LGA775 socket
for which it is intended.
§

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3

Summary

2 Processor Thermal/Mechanical Information

2.1 Mechanical Requirements

Details the physical and mechanical specifications for the processor.

2.2 Thermal Requirements

Outlines the thermal specifications like Thermal Profile and TCONTROL.

2.3 Heatsink Design Considerations

Factors to consider for heatsink design, including surface area and conduction.

3 Thermal Metrology

3.1 Characterizing Cooling Performance Requirements

Defines thermal characterization parameters like Psi (Ψ) for performance assessment.

3.2 Processor Thermal Solution Performance Assessment

Recommends using a Thermal Test Vehicle (TTV) for performance assessment.

3.3 Local Ambient Temperature Measurement Guidelines

Provides guidelines for measuring local ambient temperature accurately.

3.4 Processor Case Temperature Measurement Guidelines

Details procedures for accurate measurement of processor case temperature.

4 Thermal Management Logic and Thermal Monitor Feature

4.2 Thermal Monitor Implementation

Details the components and functionality of the on-die thermal monitor.

4.2.1 PROCHOT# Signal

Explains the PROCHOT# signal for indicating thermal excursions.

4.2.2 Thermal Control Circuit

Describes the TCC's role in reducing power to manage temperature.

4.2.3 Thermal Monitor 2

Details the enhanced Thermal Monitor 2 capabilities for power reduction.

4.2.4 Operation and Configuration

How the Thermal Monitor is enabled and configured via BIOS.

4.2.6 System Considerations

4.2.8 THERMTRIP# Signal

Explains the THERMTRIP# signal for catastrophic cooling failure.

4.2.10 Digital Thermal Sensor

Discusses the DTS for fan speed control and its relation to TCONTROL.

5 Intel Thermal/Mechanical Reference Design Information

5.1.1 Heatsink Performance

5.2 Environmental Reliability Testing

5.2.1 Structural Reliability Testing

5.4 Safety Requirements

Outlines safety certifications and requirements for components.

5.7 Socket and Voltage Regulation Cooling Strategy

6 Intel® Quiet System Technology (Intel® QST)

6.1 Intel® Quiet System Technology Algorithm

Explains the QST algorithm using PID control and a weighting matrix.

6.1.2 Proportional-Integral-Derivative (PID)

6.2 Board and System Implementation of Intel® Quiet System Technology

6.3 Intel® QST Configuration & Tuning

Appendix A LGA775 Socket Heatsink Loading

A.1 LGA775 Socket Heatsink Considerations

A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design

Appendix B Heatsink Clip Load Metrology

B.1 Overview

B.2 Test Preparation

B.2.1 Heatsink Preparation

Appendix C Thermal Interface Management

C.1 Bond Line Management

C.3 Interface Material Performance

Details factors affecting TIM performance: thermal resistance and wetting.

Appendix D Case Temperature Reference Metrology

D.1 Objective and Scope

D.2 Supporting Test Equipment

D.3 Thermal Calibration and Controls

D.4 IHS Groove

D.5 Thermocouple Attach Procedure

Step-by-step guide for attaching a thermocouple using solder.

D.5.1 Thermocouple Conditioning and Preparation

D.5.2 Thermocouple Attachment to the IHS

Step-by-step process for attaching the thermocouple to the IHS.

D.5.3 Solder Process

Describes the soldering process to attach the thermocouple bead.

D.5.4 Cleaning and Completion of Thermocouple Installation

D.6 Thermocouple Wire Management

Appendix E Legacy Fan Speed Control

E.1 Thermal Solution Design

E.2 Board and System Implementation

E.2.1 Choosing Fan Speed Control Settings

E.2.1.1 Temperature to Begin Fan Acceleration

E.2.1.2 Minimum PWM Duty Cycle

E.3 Combining Thermistor and Digital Thermal sensor Control

E.4 Interaction of Thermal Profile and TCONTROL

Explains how thermal profile and TCONTROL dictate fan speed.