Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 91
25. Lift the heater block and magnified lens, using tweezers quickly rotate the device
90 degrees clockwise. Using the back of the tweezers press down on the solder
this will force out the excess solder
Figure 49. Removing Excess Solder
26. Allow the device to cool down. Blowing compressed air on the device can
accelerate the cooling time. Monitor the device IHS temperature with a handheld
meter until it drops below 50° C before moving it to the microscope for the final
steps
D.5.4 Cleaning and Completion of Thermocouple
Installation
27. Remove the device from the solder station and continue to monitor IHS
Temperature with a handheld meter. Place the device under the microscope and
remove the three pieces of Kapton* tape with Tweezers, keeping the longest for
re-use.
28.
Straighten the wire and work the wire in to the groove. Bend the thermocouple
over the IHS. Replace the long piece of Kapton* tape at the edge of the IHS.
Note: The wire needs to be straight so it doesn’t sit above the IHS surface at anytime
(
Figure 50).

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3