Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

BTX System Thermal Considerations
110 Thermal and Mechanical Design Guidelines
The thermal sensor location and elevation are reflected in the Flotherm thermal model
airflow illustration and pictures (see
Figure 64and Figure 65).The Intel
®
Boxed Boards
in BTX form factor have implemented a System Monitor thermal sensor. The following
thermal sensor or its equivalent can be used for this function:
Part Number: C83274-002
BizLink USA Technology, Inc.
44911 Industrial Drive
Fremont, CA 94538 USA
(510)252-0786 phone
(510)252-1178 fax
sales@bizlinktech.com
Part Number: 68801-0170
Molex Incorporated
2222 Wellington Ct.
Lisle, IL 60532
1-800-78MOLEX phone
1-630-969-1352 fax
amerinfo@molex.com
Figure 64. System Airflow Illustration with System Monitor Point Area Identified
OM16791
Power Supply
Unit
Thermal
Module
MCH
Memory
Graphics
Add-In Card
Monitor Point

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3