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Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Intel QX9770 - Core 2 Extreme Quad-Core Processor
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Case Temperature Reference Metrology
78 Thermal and Mechanical Design Guidelines
D.2 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended to use the
equipment (or equivalent) given in the table below.
Item Description Part Number
Measurement and Output
Microscope Olympus* Light microscope or equivalent SZ-40
DMM Digital Multi Meter for resistance measurement Fluke 79 Series
Thermal Meter Hand held thermocouple meter Multiple Vendors
Solder Station (see note 1 for ordering information)
Heater Block Heater assembly to reflow solder on IHS 30330
Heater WATLOW120V 150W Firerod 0212G G1A38-
L12
Transformer Superior Powerstat transformer 05F857
Miscellaneous Hardware
Solder Indium Corp. of America
Alloy 57BI / 42SN / 1AG 0.010 Diameter
52124
Flux Indium Corp. of America 5RMA
Loctite* 498
Adhesive
Super glue w/thermal characteristics 49850
Adhesive
Accelerator
Loctite* 7452 for fast glue curing 18490
Kapton* Tape For holding thermocouple in place Not Available
Thermocouple Omega *,36 gauge, “T” Type
(see note 2 for ordering information)
OSK2K1280/5SR
TC-TT-T-36-72
Calibration and Control
Ice Point Cell Omega*, stable 0 ºC temperature source for
calibration and offset
TRCIII
Hot Point Cell Omega *, temperature source to control and
understand meter slope gain
CL950-A-110
NOTES:
1. The Solder Station consisting of the Heater Block, Heater, Press and Transformer are
available from Jemelco Engineering 480-804-9514
2. This part number is a custom part with the specified insulation trimming and packaging
requirements necessary for quality thermocouple attachment, See
Figure 31. Order
from Omega Anthony Alvarez, Direct phone (203) 359-7671, Direct fax (203) 968-
7142, E-Mail: aalvarez@omega.com

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Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General IconGeneral
Processor NumberQX9770
Number of Cores4
Thread Count4
Clock Speed3.2 GHz
L2 Cache12 MB
Bus Speed1600 MHz
Thermal Design Power (TDP)136 W
SocketLGA 775
Manufacturing Process45 nm
Max Operating Temperature64.5°C
Virtualization TechnologyYes
64-bit SupportYes
Instruction SetSSE4.1
Memory Channels2
Memory TypesDDR3

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