Intel Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines 55
5.7 Socket and Voltage Regulation Cooling Strategy
Consideration for the cooling of power delivery components and CPU socket needs to
be addressed when using a remote heat exchanger. The use of a remote heat
exchanger for processor cooling can remove the cooling air that the motherboard
components around the socket need and traditionally get from an active heatsink
directly attached to the processor IHS. The Intel ALCT Reference Design incorporates
a voltage regulation and socket cooling scheme that eliminates the need for additional
fan(s) on these components. The proximity of the remote heat exchanger on the rear
panel of the ATX miniTower /Tower allows for direct impingement of airflow to the
voltage regulation components.
Figure 19 illustrates how a small gap or exit between
the fan’s pressure side and the heat exchanger inlet that is integrated into the heat
exchanger design allows for air to be introduced directly to the VR region for cooling.
This approach introduces an airflow path that doesn’t significantly impact the airflow
through the heat exchanger due to the reduced total impedance the fan sees and the
subsequent increase in the operating point of the fan. Effectively the fan operating
point increase is near the flow that is delivered to the VR and socket.
Figure 19. Diagram of Location of Heat Exchanger VR and Socket Airflow Cooling
Feature
This method of VR and socket cooling was validated by testing this configuration as
well as not having a gap. Analysis indicates that the momentum component
attributed with the pressurized airflow in the configuration shown in
Figure 19 would
help the cooling flow penetrated the VR components down to the MB surface thus
providing the best thermal performance.
Pump/coldplate
HX Fan
I/O
Socket
Built-in VR and Socket
cooling feature
VR HS
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