Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 13
2 Processor Thermal/Mechanical
Information
2.1 Mechanical Requirements
2.1.1 Processor Package
The processors covered in the document are packaged in a 775-Land LGA package
that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for
detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in
Figure 1 for
illustration only. Refer to the processor datasheet for further information. In case of
conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.
Figure 1. Package IHS Load Areas
Top Surface of IHS
to install a heatsink
IHS Step
to interface with LGA775
Socket Load Plate
Substrate
Top Surface of IHS
to install a heatsink
IHS Step
to interface with LGA775
Socket Load Plate
Substrate

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3