Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Case Temperature Reference Metrology
94 Thermal and Mechanical Design Guidelines
Figure 54. Removing Excess Adhesive from IHS
33. Using a blade, carefully shave any adhesive that is above the IHS surface
(
Figure 54). The preferred method is to shave from the edge to the center of the
IHS.
Note: The adhesive shaving step should be performed while the adhesive is partially cured,
but still soft. This will help to keep the adhesive surface flat and smooth with no pits
or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a
second time.
34. Clean IHS surface with IPA and a wipe.
35. Clean the LGA pads with IPA and a wipe.
36. Replace the land side cover on the device.
37. Perform a final continuity test.
38. Wind the thermocouple wire into loops and secure or if provided by the vendor
back onto the plastic roll. (
Figure 55).
Figure 55. Finished Thermocouple Installation
39. Place the device in a tray or bag until it’s ready to be used for thermal testing use.

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3