Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 81
The orientation of the groove relative to the package pin 1 indicator (gold triangle in
one corner of the package) is shown.
Figure 33 for the 775-Land LGA package IHS.
Figure 33. IHS Groove on the 775-LAND LGA Package
When the processor is installed in the LGA775 socket, the groove is perpendicular to
the socket load lever, and on the opposite side of the lever, as shown
Figure 34.
Figure 34. IHS Groove Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of holding drawing specified tolerances. IHS
groove geometry is critical for repeatable placement of the thermocouple bead,
ensuring precise thermal measurements. The specified dimensions minimize the
impact of the groove on the IHS under the socket load. A larger groove may cause the
IHS to warp under the socket load such that it does not represent the performance of
an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Pin1
indicator
IHS Groove

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3