Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Intel Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines 51
Table 8. Reliability Test Results
Use
Condition
Test Conditions Failure
mechanism
Results
T
LIQUID
= 75 ºC
for 16 weeks
1 0/10 failure
T
LIQUID
= 50 ºC 2 0.25-0.30 grams/week
T
LIQUID
= 50 ºC 3 Insignificant change in Ψca for 3
samples
Continuous
Operation
T
LIQUID
= 50 ºC 4 2% average RPM degradation after 8
weeks for 3 samples
T
LIQUID
= 35-60 ºC,
5500 cycles
1 0/3 failure
T
LIQUID
= 35-60 ºC,
5500 cycles
2 3 grams loss after all cycles for 3
samples
On-off
Cycles
T
LIQUID
= 35-60 ºC,
7500 cycles
4 No RPM degradation for 0/3 samples
5.2.4 Recommended BIOS/CPU/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational motherboard that has not been exposed to any
battery of tests prior to the test being considered.
Testing setup should include the following components, properly assembled and/or
connected:
•
Appropriate system motherboard
• Processor
•
All enabling components, including socket and thermal solution parts
• Power supply
•
Disk drive
• Video card
•
DIMM
• Keyboard
• Monitor
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors.

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3

Summary

2 Processor Thermal/Mechanical Information

2.1 Mechanical Requirements

Details the physical and mechanical specifications for the processor.

2.2 Thermal Requirements

Outlines the thermal specifications like Thermal Profile and TCONTROL.

2.3 Heatsink Design Considerations

Factors to consider for heatsink design, including surface area and conduction.

3 Thermal Metrology

3.1 Characterizing Cooling Performance Requirements

Defines thermal characterization parameters like Psi (Ψ) for performance assessment.

3.2 Processor Thermal Solution Performance Assessment

Recommends using a Thermal Test Vehicle (TTV) for performance assessment.

3.3 Local Ambient Temperature Measurement Guidelines

Provides guidelines for measuring local ambient temperature accurately.

3.4 Processor Case Temperature Measurement Guidelines

Details procedures for accurate measurement of processor case temperature.

4 Thermal Management Logic and Thermal Monitor Feature

4.2 Thermal Monitor Implementation

Details the components and functionality of the on-die thermal monitor.

4.2.1 PROCHOT# Signal

Explains the PROCHOT# signal for indicating thermal excursions.

4.2.2 Thermal Control Circuit

Describes the TCC's role in reducing power to manage temperature.

4.2.3 Thermal Monitor 2

Details the enhanced Thermal Monitor 2 capabilities for power reduction.

4.2.4 Operation and Configuration

How the Thermal Monitor is enabled and configured via BIOS.

4.2.6 System Considerations

4.2.8 THERMTRIP# Signal

Explains the THERMTRIP# signal for catastrophic cooling failure.

4.2.10 Digital Thermal Sensor

Discusses the DTS for fan speed control and its relation to TCONTROL.

5 Intel Thermal/Mechanical Reference Design Information

5.1.1 Heatsink Performance

5.2 Environmental Reliability Testing

5.2.1 Structural Reliability Testing

5.4 Safety Requirements

Outlines safety certifications and requirements for components.

5.7 Socket and Voltage Regulation Cooling Strategy

6 Intel® Quiet System Technology (Intel® QST)

6.1 Intel® Quiet System Technology Algorithm

Explains the QST algorithm using PID control and a weighting matrix.

6.1.2 Proportional-Integral-Derivative (PID)

6.2 Board and System Implementation of Intel® Quiet System Technology

6.3 Intel® QST Configuration & Tuning

Appendix A LGA775 Socket Heatsink Loading

A.1 LGA775 Socket Heatsink Considerations

A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design

Appendix B Heatsink Clip Load Metrology

B.1 Overview

B.2 Test Preparation

B.2.1 Heatsink Preparation

Appendix C Thermal Interface Management

C.1 Bond Line Management

C.3 Interface Material Performance

Details factors affecting TIM performance: thermal resistance and wetting.

Appendix D Case Temperature Reference Metrology

D.1 Objective and Scope

D.2 Supporting Test Equipment

D.3 Thermal Calibration and Controls

D.4 IHS Groove

D.5 Thermocouple Attach Procedure

Step-by-step guide for attaching a thermocouple using solder.

D.5.1 Thermocouple Conditioning and Preparation

D.5.2 Thermocouple Attachment to the IHS

Step-by-step process for attaching the thermocouple to the IHS.

D.5.3 Solder Process

Describes the soldering process to attach the thermocouple bead.

D.5.4 Cleaning and Completion of Thermocouple Installation

D.6 Thermocouple Wire Management

Appendix E Legacy Fan Speed Control

E.1 Thermal Solution Design

E.2 Board and System Implementation

E.2.1 Choosing Fan Speed Control Settings

E.2.1.1 Temperature to Begin Fan Acceleration

E.2.1.2 Minimum PWM Duty Cycle

E.3 Combining Thermistor and Digital Thermal sensor Control

E.4 Interaction of Thermal Profile and TCONTROL

Explains how thermal profile and TCONTROL dictate fan speed.