Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

LGA775 Socket Heatsink Loading
4 Thermal and Mechanical Design Guidelines
4.2.8 THERMTRIP# Signal.................................................................36
4.2.9 Cooling System Failure Warning ................................................36
4.2.10 Digital Thermal Sensor.............................................................37
4.2.11 Platform Environmental Control Interface (PECI)..........................38
5 Intel Thermal/Mechanical Reference Design Information.......................................39
5.1 Validation Results for the ATX Reference Design .......................................39
5.1.1 Heatsink Performance..............................................................40
5.1.2 Acoustics ...............................................................................40
5.1.3 Altitude..................................................................................41
5.1.4 Reference Heatsink Thermal Validation.......................................41
5.1.5 Fan Motor Performance ............................................................42
5.1.6 Pump Motor Performance .........................................................43
5.2 Environmental Reliability Testing............................................................44
5.2.1 Structural Reliability Testing .....................................................44
5.2.1.1 Random Vibration Test Procedure................................44
5.2.1.2 Shock Test Procedure................................................45
5.2.2 Power Cycling.........................................................................46
5.2.3 Reliability Testing....................................................................46
5.2.3.1 Tubing Material Selection...........................................48
5.2.3.2 Reservoir Sizing .......................................................48
5.2.3.3 Reliability Test Results...............................................50
5.2.4 Recommended BIOS/CPU/Memory Test Procedures......................51
5.3 Material and Recycling Requirements ......................................................52
5.4 Safety Requirements ............................................................................52
5.5 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......52
5.6 Reference Attach Mechanism..................................................................54
5.7 Socket and Voltage Regulation Cooling Strategy .......................................55
6 Intel
®
Quiet System Technology (Intel
®
QST) .....................................................57
6.1 Intel
®
Quiet System Technology Algorithm...............................................57
6.1.1 Output Weighting Matrix ..........................................................58
6.1.2 Proportional-Integral-Derivative (PID)........................................58
6.2 Board and System Implementation of Intel
®
Quiet System Technology .......60
6.3 Intel
®
QST Configuration & Tuning..........................................................62
6.4 Fan Hub Thermistor and Intel
®
QST ........................................................62
Appendix A LGA775 Socket Heatsink Loading ......................................................................63
A.1 LGA775 Socket Heatsink Considerations ..................................................63
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
®
Reference Design .................................................................................
64
A.2.1 Heatsink Preload Requirement Limitations...................................64
A.2.2 Motherboard Deflection Metric Definition.....................................64
A.2.3 Board Deflection Limits ............................................................66
A.2.4 Board Deflection Metric Implementation Example.........................66
A.2.5 Additional Considerations .........................................................67
A.2.5.1 Motherboard Stiffening Considerations.........................68
A.3 Heatsink Selection Guidelines.................................................................68
Appendix B Heatsink Clip Load Metrology............................................................................69
B.1 Overview ............................................................................................69
B.2 Test Preparation...................................................................................69

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3