Intel QX9770 - Core 2 Extreme Quad-Core Processor

Thermal and Mechanical Design Guidelines 5
B.2.1 Heatsink Preparation................................................................69
B.2.2 Typical Test Equipment ............................................................72
B.3 Test Procedure Examples.......................................................................72
B.3.1 Time-Zero, Room Temperature Preload Measurement...................73
B.3.2 Preload Degradation under Bake Conditions ................................73
Appendix C Thermal Interface Management.........................................................................75
C.1 Bond Line Management.........................................................................75
C.2 Interface Material Area..........................................................................75
C.3 Interface Material Performance...............................................................75
Appendix D Case Temperature Reference Metrology..............................................................77
D.1 Objective and Scope.............................................................................77
D.2 Supporting Test Equipment....................................................................78
D.3 Thermal Calibration and Controls............................................................79
D.4 IHS Groove .........................................................................................79
D.5 Thermocouple Attach Procedure .............................................................82
D.5.1 Thermocouple Conditioning and Preparation................................82
D.5.2 Thermocouple Attachment to the IHS.........................................83
D.5.3 Solder Process........................................................................88
D.5.4 Cleaning and Completion of Thermocouple Installation..................91
D.6 Thermocouple Wire Management............................................................95
Appendix E Legacy Fan Speed Control................................................................................97
E.1 Thermal Solution Design .......................................................................97
E.1.1 Determine Thermistor Set Points ...............................................97
E.1.2 Minimum Fan Speed Set Point...................................................98
E.2 Board and System Implementation .........................................................99
E.2.1 Choosing Fan Speed Control Settings.........................................99
E.2.1.1 Temperature to Begin Fan Acceleration......................100
E.2.1.2 Minimum PWM Duty Cycle........................................ 102
E.3 Combining Thermistor and Digital Thermal sensor Control........................ 103
E.4 Interaction of Thermal Profile and T
CONTROL
.............................................103
Appendix F BTX System Thermal Considerations................................................................109
Appendix G Mechanical Drawings.....................................................................................113
Appendix H Intel Enabled Reference Solution Information....................................................123