Intel QX9770 - Core 2 Extreme Quad-Core Processor User Manual

Thermal and Mechanical Design Guidelines 7
Figure 49. Removing Excess Solder ...................................................................91
Figure 50. Thermocouple placed into groove .......................................................92
Figure 51. Removing Excess Solder ...................................................................92
Figure 52. Filling Groove with Adhesive..............................................................93
Figure 53. Application of Accelerant...................................................................93
Figure 54. Removing Excess Adhesive from IHS ..................................................94
Figure 55. Finished Thermocouple Installation.....................................................94
Figure 56. Thermocouple Wire Management........................................................95
Figure 57. Thermistor Set Points .......................................................................98
Figure 58. Example Fan Speed Control Implementation ........................................99
Figure 59. Fan Speed Control..........................................................................100
Figure 60. Temperature Range = 5 °C .............................................................101
Figure 61. Temperature Range = 10 °C............................................................102
Figure 62. Digital Thermal Sensor and Thermistor..............................................103
Figure 63. FSC Definition Example...................................................................105
Figure 64. System Airflow Illustration with System Monitor Point Area Identified.... 110
Figure 65. Thermal sensor Location Illustration .................................................111
Figure 66. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1..................................
114
Figure 67. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2..................................
115
Figure 68. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3..................................
116
Figure 69. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 1......................................................................
117
Figure 70. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 2......................................................................
118
Figure 71. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 3......................................................................
119
Figure 72. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 4......................................................................
120
Figure 73. Balanced Technology Extended (BTX) Thermal Module Keep Out
Volumetric – Sheet 5......................................................................
121
Figure 74. Intel Advanced Liquid Cooling Technology Assembly............................122
Tables
Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions..............21
Table 2. Intel Liquid Cooled Reference Design Performance (ALCT).........................40
Table 3. Acoustic Results..................................................................................40
Table 4. Fan Electrical Performance Requirements ...............................................42
Table 5. Pump Electrical Performance Requirements.............................................43
Table 6. The Reliability Test Matrix ....................................................................47
Table 7. The Weekly Loss Rate of Different Tubing Materials..................................48
Table 8. Reliability Test Results.........................................................................51
Table 9. Maximum Estimated Processor Current Capability at 35 ºC External
Ambient.............................................................................................
56
Table 10. Board Deflection Configuration Definitions ............................................65
Table 11. Typical Test Equipment......................................................................72
Table 12. FSC Definitions ...............................................................................104
Table 13. ATX FSC Settings............................................................................106
Table 14. BTX Fan Speed Control Settings........................................................106
Table 15. Intel Representative Contact for Licensing Information .........................123
Table 16. Intel Reference Component ATX Thermal Solution Providers..................123

Intel QX9770 - Core 2 Extreme Quad-Core Processor Specifications

General

Processor Number	QX9770
Number of Cores	4
Thread Count	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus Speed	1600 MHz
Thermal Design Power (TDP)	136 W
Socket	LGA 775
Manufacturing Process	45 nm
Max Operating Temperature	64.5°C
Virtualization Technology	Yes
64-bit Support	Yes
Instruction Set	SSE4.1
Memory Channels	2
Memory Types	DDR3

Summary

2 Processor Thermal/Mechanical Information

2.1 Mechanical Requirements

Details the physical and mechanical specifications for the processor.

2.2 Thermal Requirements

Outlines the thermal specifications like Thermal Profile and TCONTROL.

2.3 Heatsink Design Considerations

Factors to consider for heatsink design, including surface area and conduction.

3 Thermal Metrology

3.1 Characterizing Cooling Performance Requirements

Defines thermal characterization parameters like Psi (Ψ) for performance assessment.

3.2 Processor Thermal Solution Performance Assessment

Recommends using a Thermal Test Vehicle (TTV) for performance assessment.

3.3 Local Ambient Temperature Measurement Guidelines

Provides guidelines for measuring local ambient temperature accurately.

3.4 Processor Case Temperature Measurement Guidelines

Details procedures for accurate measurement of processor case temperature.

4 Thermal Management Logic and Thermal Monitor Feature

4.2 Thermal Monitor Implementation

Details the components and functionality of the on-die thermal monitor.

4.2.1 PROCHOT# Signal

Explains the PROCHOT# signal for indicating thermal excursions.

4.2.2 Thermal Control Circuit

Describes the TCC's role in reducing power to manage temperature.

4.2.3 Thermal Monitor 2

Details the enhanced Thermal Monitor 2 capabilities for power reduction.

4.2.4 Operation and Configuration

How the Thermal Monitor is enabled and configured via BIOS.

4.2.6 System Considerations

4.2.8 THERMTRIP# Signal

Explains the THERMTRIP# signal for catastrophic cooling failure.

4.2.10 Digital Thermal Sensor

Discusses the DTS for fan speed control and its relation to TCONTROL.

5 Intel Thermal/Mechanical Reference Design Information

5.1.1 Heatsink Performance

5.2 Environmental Reliability Testing

5.2.1 Structural Reliability Testing

5.4 Safety Requirements

Outlines safety certifications and requirements for components.

5.7 Socket and Voltage Regulation Cooling Strategy

6 Intel® Quiet System Technology (Intel® QST)

6.1 Intel® Quiet System Technology Algorithm

Explains the QST algorithm using PID control and a weighting matrix.

6.1.2 Proportional-Integral-Derivative (PID)

6.2 Board and System Implementation of Intel® Quiet System Technology

6.3 Intel® QST Configuration & Tuning

Appendix A LGA775 Socket Heatsink Loading

A.1 LGA775 Socket Heatsink Considerations

A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design

Appendix B Heatsink Clip Load Metrology

B.1 Overview

B.2 Test Preparation

B.2.1 Heatsink Preparation

Appendix C Thermal Interface Management

C.1 Bond Line Management

C.3 Interface Material Performance

Details factors affecting TIM performance: thermal resistance and wetting.

Appendix D Case Temperature Reference Metrology

D.1 Objective and Scope

D.2 Supporting Test Equipment

D.3 Thermal Calibration and Controls

D.4 IHS Groove

D.5 Thermocouple Attach Procedure

Step-by-step guide for attaching a thermocouple using solder.

D.5.1 Thermocouple Conditioning and Preparation

D.5.2 Thermocouple Attachment to the IHS

Step-by-step process for attaching the thermocouple to the IHS.

D.5.3 Solder Process

Describes the soldering process to attach the thermocouple bead.

D.5.4 Cleaning and Completion of Thermocouple Installation

D.6 Thermocouple Wire Management

Appendix E Legacy Fan Speed Control

E.1 Thermal Solution Design

E.2 Board and System Implementation

E.2.1 Choosing Fan Speed Control Settings

E.2.1.1 Temperature to Begin Fan Acceleration

E.2.1.2 Minimum PWM Duty Cycle

E.3 Combining Thermistor and Digital Thermal sensor Control

E.4 Interaction of Thermal Profile and TCONTROL

Explains how thermal profile and TCONTROL dictate fan speed.