Preparation for
Use
TP04100A Interface
&
Applications
Rev A: 06/15/98
AT
TEST
TEMPERATURES
BELOW
ROOM
AMBIENT
1.
WTANDTESTSOCKETMUSlBE
MOISTURE PROTECTED BY USING
ME THERMALCAP
TO
SIUCONE
RUBBER
SEAL.
2. BEST MOISTURE PRQTECWN OF
TESTER ELEClRONlCS
CAN
BE
ACHIEVED
BY
PROVlDlNGAN
PJR
GAP
WND TESl SOCKEl
LEADS
AND PURGING ME AREA
WllH
DRY
AIR.
3.
BY UTlllZlNG ATHERMAL SHROUD
TO
CONFINE THE TEMPERATURE
CONROLLED AIR WHEN THE
IMMEDW AREA AROUND ME
DUl
AND
SOCK3
BETIER HWmANSFER
CAN
BE ACHIEVED FROM
AlRSmEAM
TO Dm.
NOTE: TEMPERANRE TWWSmON TIMES
ARE
DEPENMM ON hnASS,
SPECIFIC HEAT CHARACTERISTICS AND THE MERMAL
COUPUNG AND THERMAL CONDUCTION PAW
TO ME DUT, TEST SOCW, TEST LEADS SD
OTHER FDrmRlNG FEATURES
IMERFACE
SEAL
(KEEPS OUT MOISTURE
FROM DUT
AREA)
THERMAL SHROUD, CONCENTRATES
AIR AROUND DUT
WI
SENSOR
CONNECT07
7
(To THERMOSIREAM
FRONT PANEL)
DUT
SENSOR
(L~TED\
/
,,.,mP".,PAnt
mtm
&"WAND
TRAVEL
[FOR INSERTING AND
ExmACnNG
M)
111111111111111
\
TO PREVEM FROSING
610
PLATFORM
'
\
ON
IEADS.
(TEST BOARD)
TEST SOCKET LEADS
Figure
2-11
Typical Test Site: Head, Cap, Shroud,
DUT,
Air Purge Manifold
Page
2-26
41 1A-S2F.doc
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