Preparation
for
Use
TP04100A Interface &Applications
Follow these sensor interfacing guidelines:
Rev A: 0611
5/98
TEMPTRONIC
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All materials used in fixturing should be capable of withstanding the total system specified
temperature range as listed in the System Specification (see Section 1, "Specifications").
The DUT sensor must be located within the test fixture, be in contact with the DUT, and be
properly connected to the appropriate Input port (socket) on the System front panel (see Section
5,
"Thermocouple Input Access").
When removing and installing the thermocouple plug at the System Front Panel port, take care to
observe thermocouple connector polarity.
The sensor should be durable, be of low mass to retard conductivity, with reasonable surface
contact area, and be mounted such that it is thermally isolated from the socket to eliminate heat
sinking.
The fixturing should ensure repeatable contact with the DUT.
The tested device body should not contact the socket body.
Do not ground the sensor:
if the DUT case is grounded, then isolate the sensor by using a material
which is electrically nonconductive but is an excellent thermal conductor.
It is preferable that the thermocouple junction and approximately 20-30x the thermocouple wire
diameter be in contact with the center of the DUT to minimize heatsinking (see Figure 2-13,
"Alternative Thermocouple Attachment").
Mount the sensor beneath the DUT to shield it from high velocity ThermoStream air.
If the sensor is mounted on top of the device and is in the airstream, then timeltemperature
measurement will not be the required DUT temperature but be some weighted average of both
device and air temperatures.
Use silicone rubber as an insulated base on which the test socket is centered and mounted; make the
base large enough to accommodate the Thermal Cap for proper sealing (see Section 2-15.4.2,
"Insulation Kits: Fitting and Sealing").
When modifying the test socket to accept temperature sensors (per the supplied drawings), care
should be taken to prevent any stress in the sensor lead wires.
Page
2-32
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