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Architecture | ARM Cortex-A8 |
---|---|
Core Count | 1 |
Clock Speed | Up to 1 GHz |
Process Technology | 45 nm |
Integrated Graphics | SGX530 |
Memory Support | DDR2, DDR3, DDR3L |
Interfaces | UART, I2C, CAN, USB, Ethernet |
Integrated Peripherals | ADC, PWM, Timers, Watchdog Timer |
Package / Case | BGA |
USB | USB 2.0 |
Ethernet | 10/100 Ethernet MAC |
UART | 6x UART |
I2C | 3x I2C |
ADC | 8-channel 12-bit ADC |
Watchdog Timer | 1x 32-bit Watchdog Timer |
Operating Temperature | -40°C to 105°C |
Power Supply | 1.1V to 1.3V (Core), 1.8V to 3.3V (I/O) |
Lists the key hardware capabilities and interfaces of the AM335x processors.
Shows the physical pin assignments for the ZCE and ZCZ packages.
Details pin characteristics, signal names, and multiplexing modes.
Explains the signals and their potential multiplexing configurations.
Provides general information on timing parameters and their relation to operating conditions.
Guidelines for monotonic transitions of clock and control signals.
Electrical data and timing specifications for the DCAN interface.
Electrical data and timing requirements for the DMTimer peripheral.
Electrical and timing specifications for the EMAC and Switch.
Detailed information on the General-Purpose Memory Controller (GPMC).
Timing conditions for GPMC in synchronous mode with NOR flash.
Timing conditions for GPMC in asynchronous mode with NOR flash.
Describes interfaces for various DDR memory types.
Routing guidelines specific to the DDR2 interface.
Minimum PCB stackup requirements for DDR2 routing.
Placement guidelines for DDR2 devices relative to the AM335x.
Recommendations for bulk bypass capacitors for DDR2.
Definition of net classes for DDR2 interface signals.
Specifications for DDR2 signal termination.
Routing guidelines for DDR3 and DDR3L memory interfaces.
Minimum PCB stackup requirements for DDR3 routing.
Placement guidelines for DDR3 devices relative to the AM335x.
Definition of the keepout region for DDR3 circuitry.
Recommendations for bulk bypass capacitors for DDR3.
Specifications for high-speed bypass capacitors for DDR3.
Definition of net classes for DDR3 interface signals.
Specifications for DDR3 signal termination.
Guidelines for routing the DDR_VREF signal.
Details on the VTT supply and its routing.
Topologies for CK net classes with two DDR3 devices.
Routing guidelines for CK and ADDR_CTRL with two DDR3 devices.
Topologies for CK net classes with one DDR3 device.
Routing guidelines for CK and ADDR_CTRL with one DDR3 device.
Defines data line topologies and routing.
Topologies for DQS[x] and DQ[x] signals.
Specifications for CK and ADDR_CTRL routing.
Specifications for DQS[x] and DQ[x] routing.
Electrical data and timing for the I2C interface.
Details regarding the LCD Interface Display Driver (LIDD) mode.
Switching characteristics for LCD raster mode operation.
Device-specific information for the McASP peripheral.
Electrical data and timing for the McASP interface.
Electrical data and timing for the McSPI interface.
Timing requirements for McSPI in slave mode.
Timing requirements for McSPI in master mode.
Electrical data and timing for the MMC interface.
Details on the PRU-ICSS PRU module.
Electrical data and timing for PRU-ICSS PRU in I/O mode.
Electrical data and timing for PRU-ICSS PRU Parallel Capture mode.
Electrical data and timing for PRU-ICSS PRU Shift Mode.
Electrical data and timing for the UART interface.
Details on the UART IrDA interface parameters.
Information on device support and development tools.
Overview of software and hardware development tools.
Links to relevant technical documentation and resources.
Lists key documents describing the AM335x MPU and peripherals.
Links to TI community resources for support and collaboration.
Lists trademarks relevant to the AM335x platform and TI products.
Important warnings and precautions regarding ESD handling.
Details the Via Channel technology used in ZCZ packages.
Provides information on mechanical packaging and orderable parts.