Texas Instruments TMS570LS0714 User Manual

4
TMS570LS0714
SPNS226E –JUNE 2013–REVISED NOVEMBER 2016 www.ti.com
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Device Overview Copyright © 2013–2016, Texas Instruments Incorporated
The device has multiple communication interfaces: three MibSPIs; two SPIs; two SCIs, one of which can
be used as LIN; up to three DCANs; and one I2C module. The SPI provides a convenient method of serial
interaction for high-speed communications between similar shift-register type devices. The LIN supports
the Local Interconnect standard 2.0 and can be used as a UART in full-duplex mode using the standard
Non-Return-to-Zero (NRZ) format. The DCAN supports the CAN 2.0B protocol standard and uses a serial,
multimaster communication protocol that efficiently supports distributed real-time control with robust
communication rates of up to 1 Mbps. The DCAN is ideal for applications operating in noisy and harsh
environments (for example, automotive and industrial fields) that require reliable serial communication or
multiplexed wiring.
The I2C module is a multimaster communication module providing an interface between the
microcontroller and an I
2
C-compatible device through the I
2
C serial bus. The I2C module supports speeds
of 100 and 400 kbps.
A Frequency-Modulated Phase-Locked Loop (FMPLL) clock module is used to multiply the external
frequency reference to a higher frequency for internal use. The FMPLL provides one of the six possible
clock source inputs to the Global Clock Module (GCM). The GCM manages the mapping between the
available clock sources and the device clock domains.
The device also has an external clock prescaler (ECP) circuit that when enabled, outputs a continuous
external clock on the ECLK terminal. The ECLK frequency is a user-programmable ratio of the peripheral
interface clock (VCLK) frequency. This low-frequency output can be monitored externally as an indicator of
the device operating frequency.
The Direct Memory Access (DMA) controller has 16 channels, 32 peripheral requests,
and parity protection on its memory. An MPU is built into the DMA to protect memory against erroneous
transfers.
The Error Signaling Module (ESM) monitors device errors and determines whether an interrupt or external
error signal (nERROR) is asserted when a fault is detected. The nERROR terminal can be monitored
externally as an indicator of a fault condition in the microcontroller.
With integrated functional safety features and a wide choice of communication and control peripherals, the
TMS570LS0714 device is an ideal solution for high-performance, real-time control applications with safety-
critical requirements.
(1) For more information, see Section 10, Mechanical Packaging and Orderable Information.
Device Information
(1)
PART NUMBER PACKAGE BODY SIZE
TMS570LS0714PGE LQFP (144) 20.0 mm × 20.0 mm
TMS570LS0714PZ LQFP (100) 14.0 mm × 14.0 mm

Texas Instruments TMS570LS0714 Specifications

General

Core	ARM Cortex-R4F
Clock Speed	80 MHz
RAM	64 KB
Operating Temperature	-40°C to 125°C
Operating Voltage	3.0 V to 3.6 V
Watchdog Timer	Yes
Communication Interfaces	CAN, SPI, UART
Package	LQFP
Safety Features	ECC
ADC	12-bit ADC

Summary

Device Overview

Features

Lists high-level features of the microcontroller, including CPU, memory, and peripherals.

Applications

Describes typical applications like EPS, Braking Systems, Automotive, Aerospace.

Description

Provides a detailed description of the device's architecture and capabilities.

Functional Block Diagram

Illustrates the device's internal structure and interconnects between modules.

Terminal Configuration and Functions

Pin Diagrams

Shows physical pin assignments for the PGE (144-pin) and PZ (100-pin) packages.

Signal Descriptions

Describes the function of each signal pin, including type and internal pullup/pulldown.

Pin Multiplexing

Explains how pins can be multiplexed for different functions, controlled by registers.

Buffer Type

Details output buffer drive strengths and selectable modes like low-EMI.

Specifications

Absolute Maximum Ratings

Defines voltage, current, and temperature limits beyond which damage may occur.

Recommended Operating Conditions

Specifies voltage, temperature, and other conditions for reliable device operation.

Timing and Switching Characteristics

Details timing specifications for clock domains, critical for system design.

System Information and Electrical Specifications

ARM Cortex-R4F CPU Information

Summarizes features of the ARM Cortex-R4F CPU, including architecture and core implementation.

Clocks

Describes available clock sources, domains, and their configurations for system operation.

Device Memory Map

Outlines the memory map, including flash, RAM, and peripheral register addresses.

Error Signaling Module

Explains the ESM's role in managing error conditions and their severity levels.

Peripheral Information and Electrical Specifications

Enhanced PWM Modules (ePWM)

Details the ePWM modules, their interconnections, synchronization, and trip zones.

12-Bit Multibuffered Analog-to-Digital Converter (MibADC)

Describes the MibADC features, event triggers, and electrical characteristics.

General-Purpose Input/Output

Covers the GPIO module's features, configuration for input/output, and interrupt handling.

Controller Area Network (DCAN)

Highlights DCAN features, protocol support, and electrical specifications.

Device and Documentation Support

Getting Started and Next Steps

Guides users on how to begin development with the device, including tools and kits.

Tools and Software

Lists available hardware kits, evaluation modules, IDEs, compilers, and software tools.

Documentation Support

Provides information on how to get documentation updates and lists related documents.

Trademarks

Lists trademarks associated with the product and Texas Instruments.