Dell PowerEdge R6615 9JNDF - Thermal restriction matrix

Table 30. Particulate contamination specifications(continued)
Particulate contamination Specifications
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center
environments.
Table 31. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
Thermal restriction matrix
Table 32. Label reference
Label Description
STD Standard performance
HPR Gold High performance (gold grade)
EXT. HSK. External Heat sink
LP Low profile
FH Full height
DLC Direct liquid cooling
Table 33. Air cooling: Thermal restriction matrix (non-GPU) 
Configuration
No
BP
8 x 2.5-
inch U.2
4 x 3.5-inch 10 x 2.5-inch SAS
10 x 2.5-inch
NVMe
16 x E3.S
14 x E3.S
8 x E3.S
Rear storage No
Rear
Drive
s
No Rear
Drives
No
Rear
Drive
s
E3.S
x 2
No
Rear
Drives
2.5-
inch
SAS
x 2
E3.S
x 2
No
Rear
Drives
E3.S
x 2
No Rear
Drives
cTDP Model
Core
Count
CPU
TDP/
cTDP
240
W
9334 32 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
240
W
9224 24 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
240
W
9254 24 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
240
W
9124 16 35°C 35°C 35°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
34 Technical specifications