SUPREMATouch
162
Installation
MSA
US
Fig. 90 System Configuration/Maximum Loads
Fig. 91 MGO Module/Maximum Loads
When setting the number of modules allowable per rack, the following factors of influence have to
be observed:
- The power of the sensors to be connected including the losses resulting from the cable lengths
(MAI module/ MIB module).
- The currents of the modules connected to the relay driver outputs (MGO module/ MIB module:
GND terminal).
- The power requirement of the system modules (see Fig. 148 Power Requirements of the Sys-
tem Modules).
- The power available from the supply voltage.
For further details, see the tables in Chapter 10.11 and Chapter 14 and the operation and main-
tenance manuals of the sensors to be connected.
NOTE: A cooling fan must be installed and operated to prevent overheating in the installation
framework if more than 64 measuring points are fitted with MPI modules.
Configuration Examples
Standard System with 8 Inputs/8 Common Alarm Relays
Fig. 92 Configuration example 1
Maximum output current of an input 400 mA
Maximum output power of an input (Sensor and cable) 5 W
Maximum output power for a MAI module 40 W
Maximum output power for 8 MAI modules 320 W
Maximum input power for 8 MAI module 400 W
Maximum input power for a MIB module (for a track) 480 W
Maximum current load for a MIB module 20A
Maximum current load MIB module/GND terminal
(MAI module and MGO module current)
32A
Maximum output current for a MSP module (Rack - power pack) 6.5 A
Maximum output power for a MSP module (Rack - power pack) 150 W
Normal current of a driver output 0.3 A
Maximum current of a driver output 1.0 A
Maximum current for 8 driver outputs
(a MGO module has each 5 driver ICs with each 8 driver outputs)
4.0 A (8 x 0.5 A)
Maximum current total of all currents loads of a MGO module (one MGO
module is disposing of 40 driver outputs)
12 A (40 x 0.3 A)
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