SM ix G179
To select one or more memory modules for recording in the debug log file
..........................................................................................................5-170
5.31.3 RETRIEVING THE DEBUG LOG FROM THE HDD ................5-172
5.31.4 MORE ABOUT DEBUG LOG...................................................5-172
SP5857-015: SD to SD (Any)............................................................5-172
SP5857-016: Make HDD LogFile......................................................5-172
SP5857-017: Make SD Log File........................................................5-173
5.32 DIP SWITCHES ................................................................................5-174
5.32.1 I/O BOARD: DIP SW101..........................................................5-174
DETAILED SECTION DESCRIPTIONS
6. DETAILED SECTION DESCRIPTIONS ....................................... 6-1
6.1 OVERVIEW ................................................................................................6-1
6.1.1 COMPONENT LAYOUT....................................................................6-1
Paper Path............................................................................................6-2
Drive Layout..........................................................................................6-3
6.2 BOARD STRUCTURE................................................................................6-5
6.2.1 BLOCK DIAGRAM.............................................................................6-5
Controller ..............................................................................................6-7
6.3 PRINT PROCESS ......................................................................................6-9
6.3.1 OVERVIEW .......................................................................................6-9
Drum charge .........................................................................................6-9
Laser exposure .....................................................................................6-9
Development.........................................................................................6-9
Image transfer.......................................................................................6-9
Separation ..........................................................................................6-10
ID sensor ............................................................................................6-10
Cleaning..............................................................................................6-10
Quenching ..........................................................................................6-10
Cleaning..............................................................................................6-10
6.4 LASER EXPOSURE .................................................................................6-11
6.4.1 OVERVIEW .....................................................................................6-11
6.4.2 AUTO POWER CONTROL (APC)...................................................6-12
6.4.3 LD SAFETY SWITCHES .................................................................6-12
6.5 AROUND THE DRUM ..............................................................................6-13
6.5.1 OVERVIEW .....................................................................................6-13
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