© by SEMIKRON / 2017-09-07 / Technical Explanation / SKiiP
4
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These spring contacts allow solder-free connection of the driver PCB. The pressure system ensures that the
pressure is evenly applied to the numerous contacts situated next the chips, thus, resulting in a very low
thermal and Ohmic resistance R
CC’+EE’
(refer to Figure 2.4).
Figure 2.4: Main terminals construction principle
In the SKiiP 4 in contrast to previous generations of SKiiPs the bare chips are sintered and not soldered.
The sophisticated sintering process is based on a pulverized silver which creates a robust material
connection when suitable pressure and temperature is applied during the formation process. This sintering
process connects the chip and DCB surface extremely stably up to the melting point of silver which is as
high as 962°C.
Contact springs as mentioned before are used for all connections between substrate and Gate Driver PCB
like for the gate, auxiliary emitter and temperature sensor. These spring contacts allow the solder-free
connection of the driver board.
2.3 Gate Drive Unit
The Gate Driver Unit controls the behavior of the SKiiP under normal and exceptional operation. It receives,
checks and conditions the input signals to further transform them into suitable output signals to control the
gates of the employed IGBT. Furthermore the Gate Drive Unit establishes a safe signal insulation between
high and low voltage sides of the driver board. Additionally the gate drive circuit ensures a proper handling
of fault conditions as well as turning-off the IGBT safely even under exceptional conditions like short circuit
etc. The SKiiP 4 employs various user accessible parameter to configure and customize certain parameter
like threshold values through the integrated CANbus interface. Among those functions is an error storage,
too providing extended information as required for a detailed failure analysis.
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