SEMIKRON SKiiP 4 - Abbreviations Used

© by SEMIKRON / 2017-09-07 / Technical Explanation / SKiiP
®
4 Page 71/73
9. Abbreviations
Abbreviation
Meaning
CTE
Coefficient of Thermal Expansion
DBC
Direct bonded
copper
D
-
Sub
D
-
Subminiature
EMC
Electromagnetic compatibility
FRT
Fault Ride Through
FwDi
Free
-
wheeling diode
GB
halfbridge configuration
GND
Ground
IGBT
Insulated Gate Bipolar Transistor
IPM
Intelligent Power Module
IVT
Isolation Voltage Test
PCB
Printed Circuit Board
PTC
Positive Temperature Coefficent
RH
Relative Humidity
RoHS
Restriction of Hazardous Substances
SCP
Short Circuit Protection
SKiiP
Semikron intelligent integrated Power
SPS
Short Pulse Suppression
UVP
Under Voltage
Protection
SOA
Safe Operating Area