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Describes the heat sink options and design considerations for SKiiP®4.
Details the construction and technology of the SKiiP®4 power section.
Explains the function and features of the SKiiP®4 gate drive unit.
Explains the coding system for SKiiP®4 part numbers.
Presents the standard SKiiP®4 product range and current ratings.
Details the specific tests for SKiiP®4 qualification.
Covers EMC compliance and immunity tests for SKiiP®4.
Explains isolation limits and design according to EN50178 and EN61800-5-1.
Discusses altitude effects on SKiiP®4 isolation and clearance distances.
Provides a block diagram of the gate driver board functionality.
Describes the SKiFace 25-pin D-Sub connector and its pin assignment.
Details the various functions of the SKiiP®4 gate driver board.
Introduces the SKiFace interface, its pins, and descriptions.
Specifies the requirements for the external power supply for SKiiP®4.
Explains the digital input logic for controlling the SKiiP®4 IGBTs.
Describes the analogue output circuits for measurements.
Details the HALT signal functionality for enabling/disabling the gate driver.
Explains the CMN_GPIO1 signal as an inverted HALT signal.
Covers the CAN bus interface for parameterization and diagnostics.
Describes ground and shield connections for signal integrity and safety.
Provides guidelines for connecting unused digital and analogue signals.
Lists key functions: digital transmission, power-on-reset, and general overview.
Explains interlock dead time generation and short pulse suppression for protection.
Describes the IntelliOff function for reducing overvoltage during turn-off.
Covers various error detection mechanisms and their handling.
Details error delay times and primary supply under-voltage protection.
Covers errors from exceeding switching frequency and overlapping signals.
Explains overcurrent and short circuit protection mechanisms for safety.
Describes the thermal protection based on the DCB-sensor.
Covers analogue signals from sensors like current, temperature, and voltage.
Explains the integrated load current sensor and its characteristics.
Details the integrated DCB-temperature sensor and its characteristics.
Describes the DC-link voltage sensing and its output signal.
Specifies the electrical limits for power terminals.
Covers mechanical constraints related to power terminals.
Provides guidance on torque for terminal connections.
Outlines essential points for verifying the design of SKiiP®4 applications.
Explains the Safe Operating Area (SOA) for SKiiP®4 systems.
Discusses maximum blocking voltage and suitable snubber capacitors.
Defines thermal resistance concepts relevant to SKiiP®4.
Details cooling systems and coolant requirements for water-cooled SKiiP®4.
Lists materials and fluid composition for the cooling circuit.
Describes the water connections for water-cooled SKiiP®4.
Explains the isolation voltage test procedure and its implications.
Describes the Fault Ride Through function for wind turbines.
Details the special operation mode for PV-solar applications.
Provides recommendations for temperature ratings for SKiiP®4 reliability.
Discusses minimum times and current sharing for paralleled modules.
Covers considerations for parallel operation of SKiiP®4 units.
Advises on preventing condensation to ensure reliability.
Discusses the different labels applied to SKiiP®4 modules.
Describes the system label containing product identification information.
Details the half bridge laser label information.
Shows the warranty label and its implications.
Explains the Data Matrix Code format and reading.
Provides guidance on disposal of obsolete or defective components.
General| Brand | SEMIKRON |
|---|---|
| Model | SKiiP 4 |
| Category | Control Unit |
| Language | English |
