© by SEMIKRON / 2017-09-07 / Technical Explanation / SKiiP
4
Page 6/73
In this document following synonyms will be used for a power section with
• 3 half bridge modules in parallel = 3-fold
• 4 half bridge modules in parallel = 4-fold
• 6 half bridge modules in parallel = 6-fold
Figure 2.3: Half bridge “exploded assembly view”
2.1 Heat sink
SEMIKRON offers highly efficient water cooled heat sinks and air cooled aluminum heat sinks. Detailed
technical parameter are given in the datasheet of the corresponding SKiiP. Customer specific heat sinks can
be designed, simulated, measured and assembled on request as well. Suitable design rules should be
followed to create such a custom specific. Please refer to the PI 12-034 for such detailed information and
get in touch with your local SEMIKRON representative in case further assistance is required.
2.2 Power section
The SKiiP
®
4 power section is constructed utilizing pressure contact technology and without a copper base
plate, e.g. the SKiiP
®
4 is a “baseplateless” module. Thus, the pressure to attach the substrate to the
heatsink is homogenously induced by a dedicated pressure part on top, which is screwed to the heat sink.
The pressure contact technology facilitates that the Al
2
O
3
or AlN DCB (direct copper bonded) substrate is
pressed directly onto the heat sink without the use of a base plate and only a well defined minimum
amount of thermal compound is required. Contact springs are used for all auxiliary signal connections
between the substrate and the Gate Driver PCB like gates, auxiliary emitters and temperature sensor.
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