© by SEMIKRON / 2017-09-07 / Technical Explanation / SKiiP
4
Page 5/73
2. Introduction
The 4
th
generation SKiiP “SKiiP
®
4” is an Intelligent Power Module (IPM) with highest power density and
reliability. SEMIKRON’s SKiiP stands for “SEMIKRON intelligent integrated Power” indicating that three
components are integrated into one IPM:
• heat sink
• power stage
• gate drive and protection circuitry
Figure 2. 1: SKiiP
®
4 – 4 fold
The power section consists of 3, 4 or 6 parallel connected half bridge modules whereas a half bridge is
defined in Figure 2.2.. The exploded assembly view of a half bridge module is shown in Figure 2.3. and as
convention the IGBT and the diode connected between DC+ and AC are named TOP IGBT and TOP diode
respectively. Consequently, the IGBT and the diode between AC and DC- are named BOT IGBT and BOT
diode respectively.
Figure 2.2: Half bridge definition
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