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Siemens AG ā
May 1998
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1.1 Chapter index 1-1...................................................................
1.2 Data for selection and ordering 1 - 2....................................................
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2.1 Application 2-1......................................................................
2.2 Features 2-2........................................................................
2.3 Scope of functions 2-2...............................................................
2.3.1 Busbar protection 2-2................................................................
2.3.2 Circuit-breaker failure protection 2 - 3...................................................
2.3.3 Isolator replica 2-4...................................................................
2.3.4 Trip output/reset 2-5.................................................................
2.3.5 Fault recording 2-5..................................................................
2.3.6 Binary inputs, trip outputs, re-assignable alarm relays and LED's 2 - 5.......................
2.3.7 Measuring and testing functions 2 - 5...................................................
2.3.8 Operational and fault events 2 - 6.......................................................
2.3.9 Self-monitoring 2-6..................................................................
2.4 Versions 2-6........................................................................
2.4.1 Bay units 2-6.......................................................................
2.4.1.1 7SS521x-5DA00-xAA0 for panel surface mounting 2 - 6..................................
2.4.1.2 7SS521x-5CA00-xAA0 for panel or cubicle flush mounting 2 - 7............................
2.4.2 Master unit 2-7.....................................................................
2.4.2.1 7SS5200-xAxx0-0AAx in subrack ES902C (SIPAC) 2 - 7...................................
2.4.2.2 7SS5200-xBxx0-0AAx in wall-mounted casing 2 - 8......................................
2.5 Design 2-8.........................................................................
2.5.1 Fitting of the modules 2-9............................................................
2.5.2 Device connections 2-10..............................................................
2.6 Dimensions 2-11.....................................................................
2.6.1 Bay unit 2-11........................................................................
2.6.2 Master unit 2-14.....................................................................