TPT Wirebonder www.tpt.de Page 2 of 53 September 2016
1. Table of contents
Page
1. Table of contents .......................................................................................... 2
2. Quickstart .................................................................................................... 3
3. Unpacking and Packing Instructions ............................................................ 4
4. Safety Instruction .......................................................................................... 5
4.1. Power-On...................................................................................................... 5
5. Introduction ................................................................................................... 6
6. Overview ....................................................................................................... 7
6.1. Front view ..................................................................................................... 7
6.2. Back view...................................................................................................... 7
7. Basic Ultrasonic Bonding & Bond Modes ..................................................... 8
8. Bonding Tools ............................................................................................... 9
9. Tool Installation .......................................................................................... 10
10. Loading Wire to Motorized Wire Spool ................................................. 11
11. Control Puck ............................................................................................... 12
12. Menu Bond Touch Panel Display ............................................................... 13
13. Bonding Mode ............................................................................................ 14
13.1. Option H52 Dynamic Search and Stitch function ....................................... 14
14. Menu Setup Wedge Bonder Touch Panel Display ..................................... 15
15. Menu Setup Ball Bonder Touch Panel Display .......................................... 16
16. Menu Misc Touch Panel Display ................................................................ 17
17. Menu Loop Parameter Touch Panel Display.............................................. 18
18. Loop Profile Samples ................................................................................. 19
19. Menu Keyboard Touch Panel Display ........................................................ 21
20. Pitch and Pad Size ..................................................................................... 22
21. EFO System (only Ball Bonding HB08/10/14/16) ....................................... 23
22. Work Stage connector and Height Adjustment .......................................... 24
22.1. Temperature Controller for Work Stage & Tool Heater .............................. 24
23. Adjust Search height, Loop height and Work height .................................. 25
23.1. Adjust Y-Way Bond Length Only HB12/14/16 Bonder ............................. 25
23.2. Adjust Bonding Parameter in Menu “Bond” ................................................ 25
24. Find Bonding Parameters ........................................................................... 26
24.1. Tail Parameters .......................................................................................... 26
25. Bonding Parameter .................................................................................. 27
26. Option H80 "Pick and Place" ...................................................................... 29
27. Epoxy Stamping Pot ................................................................................... 29
29. Option H53 "Pull Tester" ............................................................................. 31
30. Option 85-1 "Digital Camera" ..................................................................... 34
31. Optional Software "Add Bond" for automatic Security Bond ...................... 35
32. Bump bonding ............................................................................................ 37
33. Bumps without tail. ..................................................................................... 38
34. Ribbon bonding .......................................................................................... 39
35. Bonding Sequence ..................................................................................... 40
36. Ultrasonic Generator .................................................................................. 42
36.1. Force System ............................................................................................. 42
36.2. Electronic Basic force adjustment .............................................................. 42
37. TDSW Touch Down Switch adjustment ..................................................... 43
38. Stitch Bonding and Dynamic Search .......................................................... 43
39. Wire Clamp ................................................................................................. 44
40. Tool Heater Option H40 .............................................................................. 45
41. Troubleshooting .......................................................................................... 46
42. Height Setup in Menu Bond and Setup ...................................................... 47
43. Wedge Tool ................................................................................................ 48
44. Packing Instructions ................................................................................... 49
45. Heater Stage .............................................................................................. 50
46. Laser Spotlight (Option H50) ...................................................................... 51
47. Manual Wire Spool 1/2" and 2"................................................................... 52
47.1. USB Stick.................................................................................................... 52
48. SPECIFICATION ........................................................................................ 53
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