TPT Wirebonder www.tpt.de Page 53 of 53 September 2016
48. SPECIFICATION
The TPT Bonder is a bench top size wire bonder, easy to operate and ideal for laboratories,
pilot and pre-production runs and small scale production lines. One Deep-access 90° Bond head for wire
and ribbon bonding. No hardware change necessary. Easy operation with 6,5” TFT Touch Panel Operator
System. Digital self tuning Ultrasonic generator, Stitch bonding, 100 Program storage capacities
and Heater stage Controller. Motorized 2” Wire Spool
Options:
H10 Zoom Stereo-Microscope Leica S6 20x
H26 Adjustable height heated work stage surface 60 mm
H29 Adjustable height heated work stage surface 90 mm
H40 Tool Heater and Temperature Controller with LCD Display
H50 Spot light targeting System
H51 Manual Z-Control
H55 Dual Fiber Optic illuminator
H60-XX Bonding tool for 25µ wire
H70 Gold-Wire 25m, 60 Meter, 2" Spool
H72 ½“ Wire Spool Adapter
H73 Torque Wrench 35 cNm for Bonding Tool
Technical specifications
Ultrasonic system 63,3 kHz transducer, PLL Control
Utrasonic power : 0 - 10 watt output
Bond time: 15 - 9999 msec.
Bond force: 15 - 150 grams.
Gold and Aluminium wire 17 to 75µ ( 0,7 to 3 mil )
Gold ribbon up to 25 x 250µ ( 1x 10 mil)
Motorised Wire Spool 50,8 mm ( 2 inch ) Option
Wire termination table tear / clamp Tear
Wire feed angle 90° for Wire and Ribbon
Motorized Y travel 7 mm (240 mil)
Motorized Z travel 15 mm
Throat depth 165 mm ( 6,7”)
Fine Table motion 10 mm (0,55 “)
Mouse ratio 6:1
Temperature controller up to 250°C +/- 1°C
Electrical Requirements 100 – 120 / 220 - 240V +/-10% 50/60 Hz 10A max.
Operating temperature range 18°C – 32°C
Physical Dimensions 680 mm W x 640 mm D x 490 mm H
Weight Net 50 kg
Industry Standard CE standard
NOTE: These specifications are subject to change without prior notice.
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