TPT Wirebonder www.tpt.de Page 25 of 53 September 2016
23. Adjust Search height, Loop height and Work height
A: Automatically with “Set Up” Button: see page 47
B: Manually
Press Search Height 1
st
Bond in Menu “ Setup”
And enter number for request search height
The same for 2
nd
Bond search height and Work height parameter.
with Dynamic Search see Page 27
Search height 1
st
Bond = height tool stop before 1
st
.bond
by pressing and hold start button on control puck ( Figure 15)
Now height can be adjusted with dynamic search up/down button
Search height 2
nd
.Bond = height tool stop before 2
nd
.bond
by pressing and hold start button on control puck ( Figure 15)
Now height can be adjusted with dynamic search up/down button
Loop Height = Height Bond tool rise after 1
st
Bond
Work height = Height Bond tool rise after 2
nd
Bond
23.1. Adjust Y-Way Bond Length Only HB12/14/16 Bonder
Press Y-way Auto in Menu “Bond or Loop Parameter”
And enter number for request Bond length
After 1
st
. Bond Y table travels to programmed value
23.2. Adjust Bonding Parameter in Menu “Bond”
Ultrasonic
You can adjust the Ultrasonic settings by altering the values in the bar “U/S” in the Bond Menu.
The settings can be adjusted from 0 to 2000 displaying the relative strength of the U/S signal to the tool.
The shape and the characteristics of the first and second bond differ depending on the settings.
Based on your application and the utilized substrate, finding the optimal Ultrasonic settings is a key factor for a
good bonding performance.
If the U/S is set with very low values, the strength of the U/S may not be enough to perform a bond,
or it will perform a very weak bond.
By increasing the U/S, the diameter of the Bond will increase too. However, setting the U/S value too high will
damage the substrate.
Time
The time control is used to set the time period for application of force and ultrasonic energy during the bond cycle.
The bond time is available from 15 milliseconds to 2000 milliseconds. However, the time is not a key factor for
manual bonding. For most applications, it is recommended to set the time value unchanged to 200.
Force
The force control is used to set the amount of force that will be applied to the bonding tool during the bonding
cycle. The purpose of the force is to support the plastic deformation. Having set the force with too low values, it
may not be enough to perform a bond. The amount of force that is needed for an accurate bond is also depending
on the utilized wire. Therefore, we recommend to start with the force values shown in the chapter “Recommended
Starting Parameters”. The first and second bond forces are adjustable from 15 grams to 150 grams. The force
generator provides current to effect the bond force. On signal from the logic control circuit, the current is provided
to the force solenoid in a ramped fashion until the set level is reached. At this level the power is held until the bond
time is over. The force level and bond time can be set using the Bond Menu of the touch panel controls. To
measure the static bond head force, use a gram gauge. Place the point or arm of the gram gauge at the end of the
transducer. Slowly raise the gauge until the transducer lifts to find out the actual applied force.
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