tpt HB10 - Bonding Sequence

TPT Wirebonder www.tpt.de Page 40 of 53 September 2016
35. Bonding Sequence
1. Start Position
Operator positions target under
spotlight. Clamp is closed
2. Operator holds down Control
Puck Start button
Bond Head travels down to
1
st
.search height
Operator repositions target if
necessary.
3. Operator releases Control Puck
Start button
Bond tool descends to 1
st
. Bond
TDSW activate all Bond
Parameters
4. clamp opens and tool rise to loop
height
5. Operator positions 2
nd
target
under spotlight
and/or Y-Table moves to
programmed position
10. Tool moves to programmed
Work height position
9. Tool moves to programmed Tail
y-way (clamp closed) position
8. Tool moves to programmed Tail
y-way (clamp open) position
7.Tool rise to programmed Tail up
(clamp open) position
6.Operator holds down Control Puck
Start button. Bond Head travels down
to 2
nd
.search height. Operator
repositions target if necessary..
Operator releases Control Puck Start
button. Bond tool descends to 2
nd
Bond .TDSW activate all Bond
Parameters
Wedge Bonding Sequence
Figure 13