tpt HB10 - Pitch and Pad Size

TPT Wirebonder www.tpt.de Page 22 of 53 September 2016
20. Pitch and Pad Size
Pitch means the distance between the middle point of one bond to the next bond.
Notice: bonding is easier with bigger pitch and pad size.
Smaller pitch and pad size is possible but you need special tools and optimize all conditions of parameter.
Standard Tools
Tool No.
Minimal Pad Size
Minimal Pitch
Ball 17µm
1572-10-437 GM
60µm Ø
120µm
Ball 25µm
1572-15-437 GM
100µm Ø
150µm
Wedge 17µm
4445-1515-3/4-CG-F-TIC
25µm x 38µm
80µm
Wedge 25µm
4445-1520-3/4-CG-F-TIC
40µm x 50µm
100µm
Fine Pitch Tools
Tool No.
Minimal Pad Size
Minimal Pitch
Ball 17µm
1732-10-35-437 CZ3
45µm Ø
50µm
Ball 25µm
1732-15-35-437 CZ3
80µm Ø
90µm
Wedge 17µm
4445-1307-3/4-CG-F-
DSR(003x008)-W=0025-TIC
20µm x 18µm
64µm
Wedge 25µm
4445-1507-3/4-CG-F-
DSR(003x008)-W=0025-TIC
30µm x 25µm
64µm