TPT Wirebonder www.tpt.de Page 46 of 53 September 2016
41. Troubleshooting
Troubleshooting for bonding problems see section
“Wire Bond Technology”
HB Bonder technical problems:
Symptom / Error Message Cause / Corrective Action
A. No Bond Head movement switch Bonder Off/On
Adjust TDSW switch (Page 29)
Switch to Menu “Bond”
B. No Ball after Bond Check if ON/OFF in Menu Config Tail is ON
Check gap between wire and EFO Wand
( for 25µ wire 100 to 400 µ )
C: Low EFO Power EFO Board has No Ground screw
(Page 19)
D: Tail is moving sideways Tool longer as 19 mm
under Wedge Tool Hole in Wedge to big
Clamp defect
Wedge defect
E: Error no USG found using Demo Mode Transducer not connected on US Board
US Board Defect
D-Sub Connect Bond head not connected
24V missing
Motherboard Defect
F: Set up error, using defaults Bond level to deep
G. “Setup. Offset.WB” not found in File Wrong Software in use
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