tpt HB10 - Introduction

TPT Wirebonder www.tpt.de Page 6 of 53 September 2016
5. Introduction
The HB XX ultrasonic wire bonder is characterized by vertical feed of wire or ribbon, manual X-Y
control of the work piece, HB08/08/10 is equip with motorized control of the Z Axis.
HB12/14/16 is equip with motorized control of the Z & Y Axis
All HBXX Bonder have the exclusive TFT Touch Panel Operation System.
This manual is designed to provide the operator with an understanding of the equipment operation,
characteristic features of the bonder, adjustments available to insure the best results in wire
bonding, and troubleshooting procedures for fault isolation and correction of malfunctions.
lt is strongly recommended that all operations and maintenance people read this manual thoroughly,
and obtain hands-on operating experience with the bonder. The precision and ease of operation of
the equipment, and quality of the bonding will be better appreciated by using the bonder. Familiarity
will also facilitate expeditious introduction of the equipment in production and enhance productivity.
HB06/12 is a manual/ semiautomatic thermo sonic wire or ribbon wedge bonder. This bonder was
designed to make 0.5 to 3.0 mil gold or aluminum wire or up to 1.0 x 10. 0 mil gold or aluminum
ribbon electrical interconnections on a wide range of microelectronic packages.
HB08/14 is a manual/ semiautomatic thermosonic wire ball bonder. This bonder was designed to
make 0.7 to 2 mil gold wire electrical interconnections on a wide range of microelectronic packages.
HB10/16 is a manual/ semiautomatic thermosonic wire bonder for Wedge bonding,
Ball bonding and Ball Bumping.
The HB Bonder is characterized by precision mechanism for manual X-Y control of the work
platform and work piece, a semiautomatic Z & Y control of the bonding tool, and electronic control of
the bonding variables (Force, Ultrasonic, Temperature and Time). Standard features designed into
the HB include: Leica 6:1 Zoom Stereo-microscope with 20X eyepieces, and area illuminator; work
stage with mechanical or vacuum clamping provisions. All Bond parameters and programs are
operated with 6,5” TFT Touch Panel Display. A variety of options are available to enhance
operability in special applications.
The design considerations were operator comfort and ease of operation, reliability of the bonding
system, low inertial impact of the bonding tool, and operator safety. The mechanical assembly of the
bonder consists of close tolerance bonder parts for precision operation and control. The electrical
assembly is composed of highly reliable electronic components integrated into a modular assembly
to facilitate ease of adjustment and troubleshooting.