tpt HB10 - Bonding Tools

TPT Wirebonder www.tpt.de Page 9 of 53 September 2016
8. Bonding Tools
Capillary
 used to perform Ballbonds and Ball Bumps
 conic shape
 can be characterized by e.g. Hole Diameter, Tip Diameter, Chamfer Diameter
 use a suitable Capillary, considering the Wire Diameter, Wire type and Bond Diameter
 the wire diameter is a key factor to determine the optimized hole diameter it is necessary to utilize the
optimized hole diameter to reach a high quality first bonding and loop
Wedge Tool
 used to perform Wedgebonds
 can be characterized by e.g. Hole Diameters, and angle
 there are different angles for the second hole, 30°,45°,60°
 45° is the most common angle
 use a suitable Wedge Tool, considering the Wire Diameter, Wire type and Bond size
 the wire diameter is a key factor to determine the optimized hole diameter
Capillary Wedge Tool