TPT Wirebonder www.tpt.de Page 36 of 53 September 2016
Security Ball Bump example
1. Create a complete ball program. Height Setup, bond parameters, Tail parameters, EFO parameters
Prog. 30 Ball-Wedge bond with 500 Loop and 500 length
2. Create a complete ball bump program. Height Setup, bond parameters, Tail parameters, EFO parameters
Prog. 60, a bump program without tail
3. Combine program 30 and program 60 for Bond Ball on Wedge also known as "Security Bond"
The goal is to bond the bump on the wedge bond. The wedge bond is on the edge of the capillary not in the middle
like the ball. So there is a difference between stitch bond position and ball band position
This difference depends on wire size and capillary shape.
With Standard TPT 25µm capillary the difference between stitch and ball is 50µm
The 1. Bond Program has a Y-way of 500µm
We want bond in the front of the ball bond on the stitch, so the arrow shows to right side.
The distance between Stitch and ball is 50µm, so the way is 450µm
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