130 D292469I
Appendices
Appendix A: Table of Recommended Eject Heads
Single needle for small die
Quad needle, 0.020 in. sq.
Quad needle, 0.035 in. sq.
Quad needle, 0.060 in. sq.
Quad needle, 0.085 in. sq.
Quad needle, 0.100 in. sq.
Quad needle, 0.125 in. sq.
Quad needle, 0.150 in. sq.
Quad needle, 0.200 in. sq.
Quad needle, 0.250 in. sq.
Quad needle, 0.300 in. sq.
Quad needle, 0.350 in. sq.
Quad needle, 0.400 in. sq.
Quad needle, 0.450 in. sq.
Quad needle, 0.500 in. sq.
Major width > 20x
thickness
Die under 0.0005
in. thick
These suggested eject head sizes should be used as “rules of thumb”. There may be
considerable latitude in eject head choice depending on the machine in use and special
customer needs.
The choices above will perform well using silicon die where thickness to major width
ratio is under 20:1. (Note that this is not the same as the die aspect ratio.)
For larger die thickness ratios, for GaAs die, special structures, non-surface contact, or
for use with pyramid-style die collets, please consult the factory.
Above listed eject heads contain needles with a 0.001 inch (25 micron) needle tip radius.
Blunt eject needles are available and can be quoted upon request.