Need help?Do you have a question about the V-TEK Royce DE35-ST and is the answer not in the manual?
General description of the DE35 ST and DE35-300 die pick-and-place systems.
Details utility, power, and dimensional specifications for the DE35 ST/300.
Lists environmental conditions for machine installation (indoor use, altitude, temp, humidity, voltage).
Provides essential safety guidelines for operating the machine.
Instructions for removing the mainframe from packaging and inventorying parts.
Details on connecting foot switch, transit screw, camera, eject head, power, and display.
Step-by-step guide to powering on the machine and logging into the system.
Guidance on selecting and installing the Eject Head and Pickup Tip.
Instructions for installing the Wafer Holder on the Die Eject Stage.
Procedure for aligning the camera lens for proper focus and zoom.
Initial alignment steps using tape marks and keyboard controls.
Step-by-step procedure to set up the machine for basic operation.
Process for calibrating waffle packs to ensure accurate die placement.
Overview of the OUTPUT SELECT and OUTPUT SIZES menus.
Details on selecting recipes, pick/place modes, and output options.
Steps to adjust the pickup height and horizontal position of the pickup tip.
Steps to align the needle pattern and adjust eject speed.
Guidelines for routine maintenance to ensure machine reliability.
Lubrication tasks performed every two months.
Detailed procedure for replacing and planarizing eject head needles.
General description of the DE35 ST and DE35-300 die pick-and-place systems.
Details utility, power, and dimensional specifications for the DE35 ST/300.
Lists environmental conditions for machine installation (indoor use, altitude, temp, humidity, voltage).
Provides essential safety guidelines for operating the machine.
Instructions for removing the mainframe from packaging and inventorying parts.
Details on connecting foot switch, transit screw, camera, eject head, power, and display.
Step-by-step guide to powering on the machine and logging into the system.
Guidance on selecting and installing the Eject Head and Pickup Tip.
Instructions for installing the Wafer Holder on the Die Eject Stage.
Procedure for aligning the camera lens for proper focus and zoom.
Initial alignment steps using tape marks and keyboard controls.
Step-by-step procedure to set up the machine for basic operation.
Process for calibrating waffle packs to ensure accurate die placement.
Overview of the OUTPUT SELECT and OUTPUT SIZES menus.
Details on selecting recipes, pick/place modes, and output options.
Steps to adjust the pickup height and horizontal position of the pickup tip.
Steps to align the needle pattern and adjust eject speed.
Guidelines for routine maintenance to ensure machine reliability.
Lubrication tasks performed every two months.
Detailed procedure for replacing and planarizing eject head needles.
General| Brand | V-TEK |
|---|---|
| Model | Royce DE35-ST |
| Category | Industrial Equipment |
| Language | English |
To Next Page