92 D292469I
During the placement part of the cycle, the Gripper Fingers will open to drop the die
into the Waffle Pack cavity. The placement height is not critical, for example, successful
trials have been made dropping the die from the full Arm Traverse Height. Although this
is the fastest mode of operation, it is not recommended. In general, lowering the
Gripper Fingers to about 0.010 in. from the top surface of the Waffle Pack works best.
Very little time is needed for the Gripper Fingers to open. If necessary, using Single Step
Mode adjust the delay by pressing the + / - keys when WAIT 0.100 SEC FOR GRIPPERS
TO OPEN shows in display.
At the end of the cycle, the arm will return to the wait position.
Adjust Pickup Grippers
1. Planarize Grippers.
a. Using a scrap wafer, SINGLE STEP the arm to the pick position at the pick
height.
b. Loosen the Gripper Finger Set Screws so that the Gripper Fingers fall onto
the wafer surface. Planarize the Gripper Fingers.
c. Once Gripper Fingers are level, tighten the Locking Setscrews.
d. Press the NO key to abort the cycle.
2. Adjust Gripper Width.
a. The left and right Gripper Fingers are each independently adjusted by a
Knurled Screw.
b. The Gripper Fingers can be adjusted to handle die sizes in the range of 0
to 0.75 in. Each gripper finger can close by about 0.040 in. from its rest
position, so there is considerable latitude in setup.
c. Open the gap between the Gripper Fingers until they are at least 0.050 in.
wider than the die.
3. Adjust Gripper Height.
a. SINGLE STEP the system until a die is elevated between the Gripper
Fingers.
b. Adjust Gripper Finger Height using the UP/DOWN keys until the tips of
the Gripper Fingers are clear of the wafer surface.
4. Adjust Die Elevation.
a. Die Elevation may be adjusted using the ring at the base of the Eject
Head.
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